DE 10234858 A UPAB: 20040326 NOVELTY - Device for producing a magnetron discharge, especially for magnetron sputtering, comprises a longitudinally extending target connected as cathode, a unit producing a magnetic field, an anode, a current supply, a substrate, a gas inlet unit and a receiver. The unit producing a magnetic field is structured so that it has a fixed position relative to the outer target limit in the region of the outer pole and has electromagnetic units in the region of the inner pole to position the center pole relative to the target according to a prescribed time program. USE - For coating substrates using magnetron sputtering. ADVANTAGE - The formation of a re-deposition zone is avoided
DE1004015230 A UPAB: 20051125 NOVELTY - Intensifying a pulsed magnetron discharge in a vacuum chambe...
The method involves using non-equilibrium magnetron with 35 kA/m magnetic field intensity for sputte...
DE 102009019422 A1 UPAB: 20101117 NOVELTY - The method comprises supplying an electrical energy in t...
DE 10234856 A UPAB: 20040326 NOVELTY - Coating device comprises a target and a unit producing a magn...
DE 19947935 A UPAB: 20010508 NOVELTY - Apparatus for magnetron sputtering comprises targets (1,2) su...
WO2004094686 A UPAB: 20041122 NOVELTY - Device for pulse magnetron sputtering comprises a recipient ...
DE 102009015737 A1 UPAB: 20101019 NOVELTY - The magnetron coating module (100) comprises a coating s...
DE 10145050 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 10145201 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 19860474 A UPAB: 20000818 NOVELTY - Bipolar pulsed magnetron sputter coating uses program control...
Magnetron sputter coating comprises: (a) using at least two targets and a pulsed frequency of 30-100...
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the ...
The large-scale cathode (1) for a magnetron sputtering within a vacuum chamber, comprises a target, ...
DE 10303428 A UPAB: 20040901 NOVELTY - Plasma-activated layer deposition process by cathodic sputter...
DE 10311466 A UPAB: 20041027 NOVELTY - A method for rapid deposition of layers from chemical compoun...
DE1004015230 A UPAB: 20051125 NOVELTY - Intensifying a pulsed magnetron discharge in a vacuum chambe...
The method involves using non-equilibrium magnetron with 35 kA/m magnetic field intensity for sputte...
DE 102009019422 A1 UPAB: 20101117 NOVELTY - The method comprises supplying an electrical energy in t...
DE 10234856 A UPAB: 20040326 NOVELTY - Coating device comprises a target and a unit producing a magn...
DE 19947935 A UPAB: 20010508 NOVELTY - Apparatus for magnetron sputtering comprises targets (1,2) su...
WO2004094686 A UPAB: 20041122 NOVELTY - Device for pulse magnetron sputtering comprises a recipient ...
DE 102009015737 A1 UPAB: 20101019 NOVELTY - The magnetron coating module (100) comprises a coating s...
DE 10145050 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 10145201 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 19860474 A UPAB: 20000818 NOVELTY - Bipolar pulsed magnetron sputter coating uses program control...
Magnetron sputter coating comprises: (a) using at least two targets and a pulsed frequency of 30-100...
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the ...
The large-scale cathode (1) for a magnetron sputtering within a vacuum chamber, comprises a target, ...
DE 10303428 A UPAB: 20040901 NOVELTY - Plasma-activated layer deposition process by cathodic sputter...
DE 10311466 A UPAB: 20041027 NOVELTY - A method for rapid deposition of layers from chemical compoun...
DE1004015230 A UPAB: 20051125 NOVELTY - Intensifying a pulsed magnetron discharge in a vacuum chambe...
The method involves using non-equilibrium magnetron with 35 kA/m magnetic field intensity for sputte...
DE 102009019422 A1 UPAB: 20101117 NOVELTY - The method comprises supplying an electrical energy in t...