DE 10145201 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface contains a pair of rectangular magnetron sources (1, 2) and substrate holders arranged in an evacuated chamber. The substrates are moved linearly relative to the magnetron sources during coating. The magnetron sources have tubular rotating targets having a length to diameter ratio of at least 2:1 and are arranged in a longitudinal manner to the transporting direction of the substrates. The pole lines of the magnetic central pole of the magnetron sources have a distance from each other on the target surfaces, the distance corresponding to the substrate expansion across the transporting direction. DETAILED DESCRIPTION - Preferred Features: The dis...
EP 2172578 A1 UPAB: 20100420 NOVELTY - A process removes a hard coat of varying thickness from a sof...
WO2005059197 A UPAB: 20050725 NOVELTY - Magnetron coating installation comprises a first coating sou...
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the ...
DE 10145050 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 19860474 A UPAB: 20000818 NOVELTY - Bipolar pulsed magnetron sputter coating uses program control...
WO2004094686 A UPAB: 20041122 NOVELTY - Device for pulse magnetron sputtering comprises a recipient ...
DE 102009015737 A1 UPAB: 20101019 NOVELTY - The magnetron coating module (100) comprises a coating s...
DE 10234856 A UPAB: 20040326 NOVELTY - Coating device comprises a target and a unit producing a magn...
DE 10234858 A UPAB: 20040326 NOVELTY - Device for producing a magnetron discharge, especially for ma...
DE 19947932 C UPAB: 20010515 NOVELTY - Device has an outer plasma electrode (9) with a first potenti...
FR 2872173 A UPAB: 20060124 NOVELTY - A device for applying a system of thin films, with complex phy...
WO2002103077 A UPAB: 20030214 NOVELTY - Device for the vacuum metallization of large mobile substrat...
DE 10143145 C UPAB: 20021120 NOVELTY - Production of a layer system on a substrate (2) in a vacuum d...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
Magnetron sputter coating comprises: (a) using at least two targets and a pulsed frequency of 30-100...
EP 2172578 A1 UPAB: 20100420 NOVELTY - A process removes a hard coat of varying thickness from a sof...
WO2005059197 A UPAB: 20050725 NOVELTY - Magnetron coating installation comprises a first coating sou...
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the ...
DE 10145050 C UPAB: 20021209 NOVELTY - Device for coating substrates (3) having a curved surface con...
DE 19860474 A UPAB: 20000818 NOVELTY - Bipolar pulsed magnetron sputter coating uses program control...
WO2004094686 A UPAB: 20041122 NOVELTY - Device for pulse magnetron sputtering comprises a recipient ...
DE 102009015737 A1 UPAB: 20101019 NOVELTY - The magnetron coating module (100) comprises a coating s...
DE 10234856 A UPAB: 20040326 NOVELTY - Coating device comprises a target and a unit producing a magn...
DE 10234858 A UPAB: 20040326 NOVELTY - Device for producing a magnetron discharge, especially for ma...
DE 19947932 C UPAB: 20010515 NOVELTY - Device has an outer plasma electrode (9) with a first potenti...
FR 2872173 A UPAB: 20060124 NOVELTY - A device for applying a system of thin films, with complex phy...
WO2002103077 A UPAB: 20030214 NOVELTY - Device for the vacuum metallization of large mobile substrat...
DE 10143145 C UPAB: 20021120 NOVELTY - Production of a layer system on a substrate (2) in a vacuum d...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
Magnetron sputter coating comprises: (a) using at least two targets and a pulsed frequency of 30-100...
EP 2172578 A1 UPAB: 20100420 NOVELTY - A process removes a hard coat of varying thickness from a sof...
WO2005059197 A UPAB: 20050725 NOVELTY - Magnetron coating installation comprises a first coating sou...
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the ...