Verfahren zum reaktiven Magnetron-Sputtern

DE 10311466 A UPAB: 20041027 NOVELTY - A method for rapid deposition of layers from chemical compounds by magnetic sputtering on substrates, where at least two magnetron discharges (MD) are used simultaneously where at least one of these has an impedance greater than Zs and at least one greater than Zs, where Zs is the impedance of a reactive MD for deposition of a layer of the desired chemical composition. USE - The method is useful for deposition of optical, decorative, hard, and wear decreasing coatings and other surface improving coatings on various substrates. ADVANTAGE - It has been found that use of a reactive sputtering process with simultaneous use of a low and a high impedance MD gives improved deposition efficiency