Verfahren zur Strukturierung eines aus glasartigem Material bestehenden Flaechensubstrats, glasartiges Flaechensubstrat und Verwendung des glasartigen Flaechensubstrats

DE 10241390 B UPAB: 20040421 NOVELTY - Process for structuring a flat substrate made from glassy material comprises preparing a semiconductor flat substrate (1), reducing the thickness of the flat substrate within a surface region (3) of the substrate, structuring the surface region using local material removal to form recesses (5) in the surface region, connecting the structured surface of the substrate to a glassy substrate (6), and tempering the connected substrates. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a glassy flat substrate produced by the above process. USE - For electrically contacting microelectronic or micromechanical components (claimed). ADVANTAGE - Etching steps are not required