Verfahren zum Herstellen elektrisch leitender Durchfuehrungen durch nicht- oder halbleitende Substrate

DE 102005053494 A1 UPAB: 20070727 NOVELTY - A method of producing electrically conductive leads through a semiconductor or non-conductive substrate comprises forming at least one recess in the rear of the substrate that reaches to, but not through, an electrically conductive layer on the front of the substrate. An electrically conductive material is then brought into the recess(es) from the rear to give a conductive connection to the front layer. Preferably the recesses are conical with side angles of 80degrees and are etched into the substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a substrate formed as above. USE - As a method of producing electrically conductive leads in a semiconductor or non-conductive substrate and such a substrate (all claimed). ADVANTAGE - Few process steps are required in this method