Metallisch kontaktiertes Substrat sowie Verfahren zu dessen Herstellung

DE 102009056308 A1 UPAB: 20110624 NOVELTY - The substrate (1) has a porous metallic contacting formed in a surface of the substrate, where a partial region or the whole contacting comprises matrix material (5). The contacting comprises two metals (2, 3) within two regions (I, II), respectively, where the material is hardened polymers, hardened thermoplastic and/or thermosetting material such as chemical hardened polyaddition and/or two-component adhesives i.e. epoxy resins. The contacting is made of borosilicate glass, quartz glass, soda-lime glass or plastics. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for producing a substrate. USE - Metallically contacted substrate such as solar cells, wafers, electrically isolating substrates e.g. glass substrate, ceramic substrate, plastic substrate, thermosetting material substrate, epoxy resin substrate and printed circuit board, electrically conductive substrates and semiconductors (all claimed). Can also be used for an electronic component e.g. sensor and electronic chip. ADVANTAGE - The utilization of the matrix material improves mechanical stability and adhering of contacting at the substrate, thus reducing break rates of the substrates while preventing firmness reduction by cracking and notch effect in an effective manner