10.1109/ECTC.2006.1645740Proceedings - Electronic Components and Technology Conference2006740-747PECC
As the trends in green manufacturing, miniaturization, and enhanced functionality of electronics dev...
An extensive finite element modeling and experimental testing program has been carried out to determ...
This final year project is consisted of three studies to facilitate the author to assess solder join...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
10.1109/EPTC.2006.342719Proceedings of the Electronic Packaging Technology Conference, EPTC220-22
With the requirement to increase semiconductor package functionality, larger die is being forced to ...
Except where reference is made to the work of others, the work described in this thesis is my own wo...
A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF ...
A solder interconnect fatigue life model was developed by Werner Engelmaier in the early 1980s as an...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
Due to an unprecedented pervasiveness of electronics in high performance applications, the dependabi...
In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This me...
Cette thèse vise à réaliser des développements théoriques et numériques portant sur le comportement ...
Power electronic modules (PEMs) are widely used in aerospace and automotive applications where high ...
This paper covers validation of the SRS model for a variety of BGA, flip-chip and CSP assemblies
As the trends in green manufacturing, miniaturization, and enhanced functionality of electronics dev...
An extensive finite element modeling and experimental testing program has been carried out to determ...
This final year project is consisted of three studies to facilitate the author to assess solder join...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
10.1109/EPTC.2006.342719Proceedings of the Electronic Packaging Technology Conference, EPTC220-22
With the requirement to increase semiconductor package functionality, larger die is being forced to ...
Except where reference is made to the work of others, the work described in this thesis is my own wo...
A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF ...
A solder interconnect fatigue life model was developed by Werner Engelmaier in the early 1980s as an...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
Due to an unprecedented pervasiveness of electronics in high performance applications, the dependabi...
In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This me...
Cette thèse vise à réaliser des développements théoriques et numériques portant sur le comportement ...
Power electronic modules (PEMs) are widely used in aerospace and automotive applications where high ...
This paper covers validation of the SRS model for a variety of BGA, flip-chip and CSP assemblies
As the trends in green manufacturing, miniaturization, and enhanced functionality of electronics dev...
An extensive finite element modeling and experimental testing program has been carried out to determ...
This final year project is consisted of three studies to facilitate the author to assess solder join...
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