Add to ORKGThis paper covers validation of the SRS model for a variety of BGA, flip-chip and CSP assemblies
While the electronics industry continues to strive towards miniaturization, it is important to under...
A micro-Ball Grid Array (micro-BGAs) is a Chip Scale Package (CSP) architecture that becomes increas...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
With accelerated test data suggesting that most flip-chip (FC) and Chip Scale Package (CSP) assembli...
This paper discusses design and material issues that affect the reliability of perimeter PBGA and CS...
ABSTRACT As electronic package input/output density increases and cost constraints drive the package...
This paper investigates the material, process and design influences on the reliability of BGA solder...
Ball Grid Array (BGA) packages offer increased I/O density with relatively coarse pitches, when comp...
[[abstract]]The geometry of solder joints in the flip chip technologies is primarily determined by t...
A study of the performance of Flip-Chip Chip-Scale Packages (FC-CSPs) with lead-free solder intercon...
This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The compa...
In the mechatronic devices, the finite element analyses are the most used method to determine time-d...
The visco-plastic behaviour of solder joints of two models of a flip chip FC48D6.3C457DC mounted on ...
[[abstract]]This work attempts to enhance solder joint reliability under thermal cycle loading by in...
The subject of the thesis work is to study the solder joint strength for BGA packages after differen...
While the electronics industry continues to strive towards miniaturization, it is important to under...
A micro-Ball Grid Array (micro-BGAs) is a Chip Scale Package (CSP) architecture that becomes increas...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
With accelerated test data suggesting that most flip-chip (FC) and Chip Scale Package (CSP) assembli...
This paper discusses design and material issues that affect the reliability of perimeter PBGA and CS...
ABSTRACT As electronic package input/output density increases and cost constraints drive the package...
This paper investigates the material, process and design influences on the reliability of BGA solder...
Ball Grid Array (BGA) packages offer increased I/O density with relatively coarse pitches, when comp...
[[abstract]]The geometry of solder joints in the flip chip technologies is primarily determined by t...
A study of the performance of Flip-Chip Chip-Scale Packages (FC-CSPs) with lead-free solder intercon...
This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The compa...
In the mechatronic devices, the finite element analyses are the most used method to determine time-d...
The visco-plastic behaviour of solder joints of two models of a flip chip FC48D6.3C457DC mounted on ...
[[abstract]]This work attempts to enhance solder joint reliability under thermal cycle loading by in...
The subject of the thesis work is to study the solder joint strength for BGA packages after differen...
While the electronics industry continues to strive towards miniaturization, it is important to under...
A micro-Ball Grid Array (micro-BGAs) is a Chip Scale Package (CSP) architecture that becomes increas...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43