Add to ORKGProceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
Due to an unprecedented pervasiveness of electronics in high performance applications, the dependabi...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
As the electronic packaging trend moves more toward finer pitch surface mount technology, solder joi...
10.1109/ECTC.2006.1645740Proceedings - Electronic Components and Technology Conference2006740-747PEC...
10.1109/EPTC.2006.342719Proceedings of the Electronic Packaging Technology Conference, EPTC220-22
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
With the requirement to increase semiconductor package functionality, larger die is being forced to ...
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging...
As the trends in green manufacturing, miniaturization, and enhanced functionality of electronics dev...
Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service...
A solder interconnect fatigue life model was developed by Werner Engelmaier in the early 1980s as an...
Except where reference is made to the work of others, the work described in this thesis is my own wo...
A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF ...
Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconn...
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws o...
Due to an unprecedented pervasiveness of electronics in high performance applications, the dependabi...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
As the electronic packaging trend moves more toward finer pitch surface mount technology, solder joi...
10.1109/ECTC.2006.1645740Proceedings - Electronic Components and Technology Conference2006740-747PEC...
10.1109/EPTC.2006.342719Proceedings of the Electronic Packaging Technology Conference, EPTC220-22
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
With the requirement to increase semiconductor package functionality, larger die is being forced to ...
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging...
As the trends in green manufacturing, miniaturization, and enhanced functionality of electronics dev...
Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service...
A solder interconnect fatigue life model was developed by Werner Engelmaier in the early 1980s as an...
Except where reference is made to the work of others, the work described in this thesis is my own wo...
A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF ...
Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconn...
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws o...
Due to an unprecedented pervasiveness of electronics in high performance applications, the dependabi...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
As the electronic packaging trend moves more toward finer pitch surface mount technology, solder joi...