Add to ORKGProceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
The objective of this research is to present a holistic study of the on-chip copper interconnect tec...
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws o...
Abstract- The FEM method was used to analyze the effects of lead widths and pitches on reliability o...
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
This final year project is consisted of three studies to facilitate the author to assess solder join...
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
Purpose – This paper aims to present an integrated optimisation-modelling computational approach for...
[[abstract]]This work attempts to enhance solder joint reliability under thermal cycle loading by in...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
An extensive finite element modeling and experimental testing program has been carried out to determ...
[[abstract]]During the design and manufacturing processes of electronic packaging, solder joints are...
[[abstract]]During the design and manufacturing processes of electronic packaging, solder joints are...
In 3D IC, μ-bumps and through silicon vias (TSVs) have been developed to achieve the vertical stacki...
Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. Th...
This paper describes a computational strategy for virtual design and prototyping of electronic compo...
The objective of this research is to present a holistic study of the on-chip copper interconnect tec...
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws o...
Abstract- The FEM method was used to analyze the effects of lead widths and pitches on reliability o...
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
This final year project is consisted of three studies to facilitate the author to assess solder join...
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
Purpose – This paper aims to present an integrated optimisation-modelling computational approach for...
[[abstract]]This work attempts to enhance solder joint reliability under thermal cycle loading by in...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052431-43
An extensive finite element modeling and experimental testing program has been carried out to determ...
[[abstract]]During the design and manufacturing processes of electronic packaging, solder joints are...
[[abstract]]During the design and manufacturing processes of electronic packaging, solder joints are...
In 3D IC, μ-bumps and through silicon vias (TSVs) have been developed to achieve the vertical stacki...
Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. Th...
This paper describes a computational strategy for virtual design and prototyping of electronic compo...
The objective of this research is to present a holistic study of the on-chip copper interconnect tec...
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws o...
Abstract- The FEM method was used to analyze the effects of lead widths and pitches on reliability o...