10.1109/TSM.2004.831536IEEE Transactions on Semiconductor Manufacturing173402-407ITSM
Defects in silicon wafers affect their mechanical stability considerably during their processing and...
Semiconductor design rules and process windows continue to shrink, so we face many challenges in dev...
AbstractTo cope with advances in the electronic and portable devices, electronic packaging industrie...
10.1109/TSM.2006.890314IEEE Transactions on Semiconductor Manufacturing2011-4ITSM
2004 8th International Conference on Control, Automation, Robotics and Vision (ICARCV)1485-49
10.1109/TIM.2009.2021620IEEE Transactions on Instrumentation and Measurement58123978-3984IEIM
Wafer handling in semiconductor manufacturing introduces microcracks at the wafer edge. During therm...
Non destructive techniques like scanning infrared microscopy and light beam induced current mapping...
In the first three quarters of 2013, semiconductor industry witnessed a great multiplication of 12-i...
10.1109/TSM.2007.890770IEEE Transactions on Semiconductor Manufacturing2015-12ITSM
published_or_final_versionabstractElectrical and Electronic EngineeringMasterMaster of Philosoph
We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die wa...
10.1117/12.429546Proceedings of SPIE - The International Society for Optical Engineering4317610-615P...
Deployment of an automatic visual inspection system in semiconductor industry has become increasingl...
The reduced testability of 3D integrated microelectronic systems poses severe challenges to microstr...
Defects in silicon wafers affect their mechanical stability considerably during their processing and...
Semiconductor design rules and process windows continue to shrink, so we face many challenges in dev...
AbstractTo cope with advances in the electronic and portable devices, electronic packaging industrie...
10.1109/TSM.2006.890314IEEE Transactions on Semiconductor Manufacturing2011-4ITSM
2004 8th International Conference on Control, Automation, Robotics and Vision (ICARCV)1485-49
10.1109/TIM.2009.2021620IEEE Transactions on Instrumentation and Measurement58123978-3984IEIM
Wafer handling in semiconductor manufacturing introduces microcracks at the wafer edge. During therm...
Non destructive techniques like scanning infrared microscopy and light beam induced current mapping...
In the first three quarters of 2013, semiconductor industry witnessed a great multiplication of 12-i...
10.1109/TSM.2007.890770IEEE Transactions on Semiconductor Manufacturing2015-12ITSM
published_or_final_versionabstractElectrical and Electronic EngineeringMasterMaster of Philosoph
We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die wa...
10.1117/12.429546Proceedings of SPIE - The International Society for Optical Engineering4317610-615P...
Deployment of an automatic visual inspection system in semiconductor industry has become increasingl...
The reduced testability of 3D integrated microelectronic systems poses severe challenges to microstr...
Defects in silicon wafers affect their mechanical stability considerably during their processing and...
Semiconductor design rules and process windows continue to shrink, so we face many challenges in dev...
AbstractTo cope with advances in the electronic and portable devices, electronic packaging industrie...
DOI
Add to ORKG