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Leading edge lithography processes require silicon wafers of nearly perfect flatness. In order to im...
In microelectronics processing, coating of photoresist is a common process. It is important to ensur...
10.1109/INDIN.2006.2757692006 IEEE International Conference on Industrial Informatics, INDIN'061091-...
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This paper will explore the methodologies of real-time measurement of photoresist film thickness on ...
10.1109/IECON.2003.1280565IECON Proceedings (Industrial Electronics Conference)32091-2096IEPR
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10.1117/12.410103Proceedings of SPIE - The International Society for Optical Engineering418254-64PSI...
10.1109/TSM.2002.801380IEEE Transactions on Semiconductor Manufacturing153323-330ITSM
For most applications of thin films, uniformity of film thickness over the substrate area is a neces...
10.1109/TSM.2004.831536IEEE Transactions on Semiconductor Manufacturing173402-407ITSM
10.1109/TCST.2006.883244IEEE Transactions on Control Systems Technology15199-105IETT
10.1117/12.771418Proceedings of SPIE - The International Society for Optical Engineering6922-PSIS
Leading edge lithography processes require silicon wafers of nearly perfect flatness. In order to im...
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