Simultaneous current-potential and in situ steady-state ellipsometric measurements were carried out in order to study the electropolishing of vertical copper electrodes in a 65% aqueous solution of phosphoric acid. A technique was developed for displacing the visible, viscous film with glycerol and examining whether a second film was sandwiched between the copper surface and the viscous film. By using this technique, it was demonstrated that the electropolishing process involves the formation of two films on the electrode: (i) an adherent sandwiched solid film at least 40Å in thickness, and (ii) a displaceable viscous layer of highly concentrated electrolyte about 2000-3500Å thick. The solid film was either completely or partially...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-...
The present work deals with the phenomena associated with the electrochemical dissolution of Cu in ...
The thin film shown by Hoar and Farthing to exist on the surface of copper during electropolishing i...
We have studied the electrochemical polishing of copper foils at elevated temperature, in H3PO4 elec...
tudied er spe ate du s are ffectiv rodyn 783 # A ived J a prototype for fundamental studies of elect...
The electropolishing of rotating copper-disk electrodes in concentrated phosphoric acid is studied b...
There has been a great deal of work published regarding the theoretical aspects of diffusion phenome...
There has been a great deal of work published regarding the theoretical aspects of diffusion phenome...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
Anodic dissolution of natural surface-oxidized, air-annealed, cathodically reduced, and cathodically...
The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemica...
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-...
The present work deals with the phenomena associated with the electrochemical dissolution of Cu in ...
The thin film shown by Hoar and Farthing to exist on the surface of copper during electropolishing i...
We have studied the electrochemical polishing of copper foils at elevated temperature, in H3PO4 elec...
tudied er spe ate du s are ffectiv rodyn 783 # A ived J a prototype for fundamental studies of elect...
The electropolishing of rotating copper-disk electrodes in concentrated phosphoric acid is studied b...
There has been a great deal of work published regarding the theoretical aspects of diffusion phenome...
There has been a great deal of work published regarding the theoretical aspects of diffusion phenome...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
Anodic dissolution of natural surface-oxidized, air-annealed, cathodically reduced, and cathodically...
The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemica...
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
This study investigated and compared the acid-free electropolishing of copper with the state-of-the-...
The present work deals with the phenomena associated with the electrochemical dissolution of Cu in ...