Single-wafer cleaning based on megasonic nozzle systems can be used for removing nano-particles. An optimized cleaning process must deliver a high degree of cleaning uniformity with a minimal amount of structural damage. However, the cleaning liquid is confined to a sonicated liquid jet, which is ejected by the nozzle. As a result, a high degree of complexity is introduced to the cleaning process due to the strong interdependencies between acoustic, electric and hydrodynamic characteristics of such systems. In the present work, the influence of the gas content of the cleaning liquid on the performance of a 1 MHz nozzle system is investigated and related to the intrinsic properties of the water jet. Cleaning tests are performed and the clean...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
As the semiconductor manufacturing technology for ultra-high integration devices continue to shrink ...
Single-wafer cleaning based on megasonic nozzle systems can be used for removing nano-particles. An ...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
This study investigates the cleaning performance of high intensity 360 kHz frequency on removal of n...
Aqueous chemicals and solvents are used heavily in semiconductor manufacturing, and device manufactu...
Aqueous chemicals and solvents are used heavily in semiconductor manufacturing, and device manufactu...
In integrated circuit (IC) manufacturing, particulate contamination from hundreds of processe steps ...
The occurrence of acoustic cavitation in the cleaning liquid is a crucial precondition for the perfo...
Within the last decade, the semiconductor industry has overstepped the frontier between micro- and n...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
Megasonic cleaning is routinely used in the semiconductor industry to remove particulate contaminant...
The dynamic actions of cavitation bubbles in ultrasonic fields can clean surfaces. Gas and vapor cav...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
As the semiconductor manufacturing technology for ultra-high integration devices continue to shrink ...
Single-wafer cleaning based on megasonic nozzle systems can be used for removing nano-particles. An ...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
This study investigates the cleaning performance of high intensity 360 kHz frequency on removal of n...
Aqueous chemicals and solvents are used heavily in semiconductor manufacturing, and device manufactu...
Aqueous chemicals and solvents are used heavily in semiconductor manufacturing, and device manufactu...
In integrated circuit (IC) manufacturing, particulate contamination from hundreds of processe steps ...
The occurrence of acoustic cavitation in the cleaning liquid is a crucial precondition for the perfo...
Within the last decade, the semiconductor industry has overstepped the frontier between micro- and n...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
Megasonic cleaning is routinely used in the semiconductor industry to remove particulate contaminant...
The dynamic actions of cavitation bubbles in ultrasonic fields can clean surfaces. Gas and vapor cav...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
Ultarasonic cleaning is a reliable and effective method of removing unwanted particles such as dirt ...
As the semiconductor manufacturing technology for ultra-high integration devices continue to shrink ...