Within the last decade, the semiconductor industry has overstepped the frontier between micro- and nanotechnology. With the ever shrinking dimensions of the functional elements now being located in the nanometer range, a multitude of new technological problems will have to be tackled. As surface and interface processing steps form an important part of device fabrication, they will have a crucial influence on subsequent processing steps as well. One major issue is the removal of nano-particulate contamination residing on the wafer surface in the form of residues from abrasive process steps such as chemical mechanical polishing, resist removal or plasma etching. Since substrate losses will have to be limited to sub-nanometer levels, corrosive...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
Various industrial processes such as sonochemical processing and ultrasonic cleaning strongly rely o...
In integrated circuit (IC) manufacturing, particulate contamination from hundreds of processe steps ...
Megasonic cleaning as applied in leading edge semiconductor device manufacturing strongly relies on ...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
The occurrence of acoustic cavitation in the cleaning liquid is a crucial precondition for the perfo...
The occurrence of acoustic cavitation is incorporating a multitude of interdependent effects that st...
As the semiconductor manufacturing technology for ultra-high integration devices continue to shrink ...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
This dissertation describes the finding that dissolved carbon dioxide is a potent inhibitor of sonol...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
Various industrial processes such as sonochemical processing and ultrasonic cleaning strongly rely o...
In integrated circuit (IC) manufacturing, particulate contamination from hundreds of processe steps ...
Megasonic cleaning as applied in leading edge semiconductor device manufacturing strongly relies on ...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
The occurrence of acoustic cavitation in the cleaning liquid is a crucial precondition for the perfo...
The occurrence of acoustic cavitation is incorporating a multitude of interdependent effects that st...
As the semiconductor manufacturing technology for ultra-high integration devices continue to shrink ...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
This dissertation describes the finding that dissolved carbon dioxide is a potent inhibitor of sonol...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
Various industrial processes such as sonochemical processing and ultrasonic cleaning strongly rely o...
In integrated circuit (IC) manufacturing, particulate contamination from hundreds of processe steps ...