Elektrischer Kontaktschichtaufbau

The structure has an electrical contact layer formed on a substrate or layer. The contact layer forms an electrically conductive connection to an electrically conductive element or electrical connector. The contact layer is made of titanium silicon nitride, and contains silicon in a range of 1-10 atomic percentages and metal e.g. copper and/or carbon. The contact layer is formed on an electrically conductive substrate or electrically conductive layer made of copper, gold, silver, aluminum, iron, palladium, chromium or alloy