The apparatus comprises a cooling body (31) having a convex cooling surface (32) as a perimeter, a unit for guiding a band-shaped substrate such that the substrate partially encircles the convex cooling surface at a contact area, and openings distributed over the contact area of the cooling surface and extend through the cooling surface into a cooling body. A first subset of openings extends inside a first channel in the cooling body, which opens end face of the cooling body, and a second subset of the openings extends into a second channel within the cooling body. The apparatus comprises a cooling body (31) having a convex cooling surface (32) as a perimeter, a unit for guiding a band-shaped substrate such that the substrate partially enci...
US 20090139690 A1 UPAB: 20090619 NOVELTY - The sink has a conductive base body (1) provided with str...
DE 102005013602 A1 UPAB: 20061121 NOVELTY - The electrode has an electrically conductive layer (7) p...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
DE1004050822 A UPAB: 20060523 NOVELTY - In apparatus for cooling plate-form substrates (A) under vac...
DE1004059200 A UPAB: 20060714 NOVELTY - Device for cooling a substrate (11) comprises a brush-like u...
DE 102006012960 A1 UPAB: 20071108 NOVELTY - The device for embossing polymer foil substrates (1) for...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
The apparatus (1) for layer-wise manufacturing the components made of powders of thermoplastic mater...
DE 102009023472 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
DE 102009023467 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
NOVELTY - The device has coolant-filled capillary structures (15) which have a high capillary pressu...
DE 102009023471 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
WO 2008049513 A1 UPAB: 20080528 NOVELTY - The procedure for hardening surface layer of parts of comp...
Small parts are to be coated on all sides in a vacuum in a high-productivity process either from an ...
WO 2007025519 A2 UPAB: 20070504 NOVELTY - Producing an embossed structure on a substrate comprises p...
US 20090139690 A1 UPAB: 20090619 NOVELTY - The sink has a conductive base body (1) provided with str...
DE 102005013602 A1 UPAB: 20061121 NOVELTY - The electrode has an electrically conductive layer (7) p...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
DE1004050822 A UPAB: 20060523 NOVELTY - In apparatus for cooling plate-form substrates (A) under vac...
DE1004059200 A UPAB: 20060714 NOVELTY - Device for cooling a substrate (11) comprises a brush-like u...
DE 102006012960 A1 UPAB: 20071108 NOVELTY - The device for embossing polymer foil substrates (1) for...
WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (10...
The apparatus (1) for layer-wise manufacturing the components made of powders of thermoplastic mater...
DE 102009023472 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
DE 102009023467 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
NOVELTY - The device has coolant-filled capillary structures (15) which have a high capillary pressu...
DE 102009023471 A1 UPAB: 20101216 NOVELTY - The coating plant comprises an evacuatable recipient (10...
WO 2008049513 A1 UPAB: 20080528 NOVELTY - The procedure for hardening surface layer of parts of comp...
Small parts are to be coated on all sides in a vacuum in a high-productivity process either from an ...
WO 2007025519 A2 UPAB: 20070504 NOVELTY - Producing an embossed structure on a substrate comprises p...
US 20090139690 A1 UPAB: 20090619 NOVELTY - The sink has a conductive base body (1) provided with str...
DE 102005013602 A1 UPAB: 20061121 NOVELTY - The electrode has an electrically conductive layer (7) p...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...