Vorrichtung und Verfahren zum Kuehlen plattenfoermiger Substrate

DE1004050822 A UPAB: 20060523 NOVELTY - In apparatus for cooling plate-form substrates (A) under vacuum, having at least one cooling surface (to which (A) (11) can be fixed in parallel) at the boundary of a cooling body (13) and a supply of fluid into the intermediate space (14) between the surface and (A), the shape of the cooling surface is such that parallel alignment of the side of (A) facing the surface is obtainable only by a deformation force acting on (A), this force being at least as great as the force applied to the (A) by the pressure of the fluid in the intermediate space. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a corresponding cooling method. USE - For cooling plate-form substrates, e.g. wafers, under vacuum. ADVANTAGE - An even gap is maintained between the substrate (A) and the cooling body, preventing uneven heat transfer and uneven cooling of individual regions of (A). The gap is kept sufficiently low for effective heat transfer