Die vorliegende Arbeit untersucht den Einfluss von Heizraten bis 10⁶ K/s auf die Bildung von intermetallischen Phasen in Al/Ni-Multilagen. Das Ziel ist ein mechanismenbasiertes Verständnis der Phasenbildungprozessen als Grundlage für die Entwicklung von neuartigen Nano-Kompositmaterialien. Für diesen Zweck wird eine in situ Untersuchungsmethode entwickelt, die eine thermodynamische und strukturelle Charakterisierung während der schnell ablaufenden Reaktionen ermöglicht. Durch die Kombination von chipbasierter Nanokalorimetrie mit Synchrotron-Röntgenbeugung wird eine Zeitauflösung von 15 μs erreicht. Drei Aspekte von Al/Ni-Reaktionen werden in dieser Arbeit detailliert untersucht: (i) die Festkörperreaktionen bei Heizraten unter 5...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
Reactive multilayer systems represent an innovative approach for potential usage in chip joining ap...
While extensively studied for heating rates below 1.7 K/s and above 1000 K/s, the solid-state phase ...
Das System Al-Cr-Ni ist von großer Bedeutung in der Energieerzeugungs- und der Luftfahrttechnik als ...
Interfacial reactions play an important but often overlooked role in the performance of reactive mat...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was devel...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was devel...
The synthesis of AlNi from thermally activated equimolar powder mixtures of aluminium and nickel was...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was deve...
Die strukturelle Stabilität von pulververdüstem Al85Ni10La5 Glas wurde nach Kugelmahlen mittels Rast...
AbstractThe attractive properties of Al-Ni intermetallic phases and their extensive field of technol...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
Reactive multilayer systems represent an innovative approach for potential usage in chip joining ap...
While extensively studied for heating rates below 1.7 K/s and above 1000 K/s, the solid-state phase ...
Das System Al-Cr-Ni ist von großer Bedeutung in der Energieerzeugungs- und der Luftfahrttechnik als ...
Interfacial reactions play an important but often overlooked role in the performance of reactive mat...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was devel...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was devel...
The synthesis of AlNi from thermally activated equimolar powder mixtures of aluminium and nickel was...
A two-dimensional numerical model for self-propagating reactions in Al/Ni multilayer foils was deve...
Die strukturelle Stabilität von pulververdüstem Al85Ni10La5 Glas wurde nach Kugelmahlen mittels Rast...
AbstractThe attractive properties of Al-Ni intermetallic phases and their extensive field of technol...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerg...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating p...
Reactive multilayer systems represent an innovative approach for potential usage in chip joining ap...