10.1016/j.chemosphere.2006.02.010IEEE Transactions on Advanced Packaging292343-353ITAP
Dans le cadre de l'intégration « 3D », une technologie d'assemblage par report de puces sur tranche ...
Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. Th...
This paper presents the assembly process using next generation electroformed stencils and Isotropic ...
10.1115/IPACK2007-339912007 Proceedings of the ASME InterPack Conference, IPACK 20071117-12
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
10.1109/ECTC.2008.4550103Proceedings - Electronic Components and Technology Conference1031-1035PECC
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20051209-21
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
10.1109/EPTC.2006.342704Proceedings of the Electronic Packaging Technology Conference, EPTC133-13
With the continued proliferation of low cost, portable consumer electronic products with greater fun...
10.1109/TCAPT.2006.880509IEEE Transactions on Components and Packaging Technologies293560-569ITCP
textThe electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages w...
A novel integration technique for flip-chip bonding a circuit in wafer scale pack-aging is presented...
[[abstract]]The demands for electronic packages with lower profile, lighter weight, and higher input...
Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded direc...
Dans le cadre de l'intégration « 3D », une technologie d'assemblage par report de puces sur tranche ...
Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. Th...
This paper presents the assembly process using next generation electroformed stencils and Isotropic ...
10.1115/IPACK2007-339912007 Proceedings of the ASME InterPack Conference, IPACK 20071117-12
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
10.1109/ECTC.2008.4550103Proceedings - Electronic Components and Technology Conference1031-1035PECC
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20051209-21
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
10.1109/EPTC.2006.342704Proceedings of the Electronic Packaging Technology Conference, EPTC133-13
With the continued proliferation of low cost, portable consumer electronic products with greater fun...
10.1109/TCAPT.2006.880509IEEE Transactions on Components and Packaging Technologies293560-569ITCP
textThe electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages w...
A novel integration technique for flip-chip bonding a circuit in wafer scale pack-aging is presented...
[[abstract]]The demands for electronic packages with lower profile, lighter weight, and higher input...
Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded direc...
Dans le cadre de l'intégration « 3D », une technologie d'assemblage par report de puces sur tranche ...
Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. Th...
This paper presents the assembly process using next generation electroformed stencils and Isotropic ...
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