Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
- Tay, A.A.O.
- Ho, S.L.
DOIAbstract
10.1115/IPACK2007-339912007 Proceedings of the ASME InterPack Conference, IPACK 20071117-12
10.1115/IPACK2007-339912007 Proceedings of the ASME InterPack Conference, IPACK 20071117-12
A chip-to-substrate interconnect technology is introduced which uses flexible structures to accommod...
Purpose – This paper aims to present an integrated optimisation-modelling computational approach for...
10.1109/TCAPT.2006.880509IEEE Transactions on Components and Packaging Technologies293560-569ITCP
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
10.1109/ECTC.2008.4550103Proceedings - Electronic Components and Technology Conference1031-1035PECC
10.1016/j.chemosphere.2006.02.010IEEE Transactions on Advanced Packaging292343-353ITAP
10.1109/EPTC.2006.342704Proceedings of the Electronic Packaging Technology Conference, EPTC133-13
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
10.1109/EPTC.2007.4469679Proceedings of the Electronic Packaging Technology Conference, EPTC488-49
10.1109/TCAPT.2009.2020696IEEE Transactions on Components and Packaging Technologies324838-848ITCP
Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electr...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded direc...
textThe electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages w...
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolut...
A chip-to-substrate interconnect technology is introduced which uses flexible structures to accommod...
Purpose – This paper aims to present an integrated optimisation-modelling computational approach for...
10.1109/TCAPT.2006.880509IEEE Transactions on Components and Packaging Technologies293560-569ITCP
10.1109/EPTC.2007.4469820Proceedings of the Electronic Packaging Technology Conference, EPTC499-50
10.1109/ECTC.2008.4550103Proceedings - Electronic Components and Technology Conference1031-1035PECC
10.1016/j.chemosphere.2006.02.010IEEE Transactions on Advanced Packaging292343-353ITAP
10.1109/EPTC.2006.342704Proceedings of the Electronic Packaging Technology Conference, EPTC133-13
10.1109/ITHERM.2006.1645434Thermomechanical Phenomena in Electronic Systems -Proceedings of the Inte...
10.1109/EPTC.2007.4469679Proceedings of the Electronic Packaging Technology Conference, EPTC488-49
10.1109/TCAPT.2009.2020696IEEE Transactions on Components and Packaging Technologies324838-848ITCP
Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electr...
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 20052444-45
Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded direc...
textThe electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages w...
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolut...
A chip-to-substrate interconnect technology is introduced which uses flexible structures to accommod...
Purpose – This paper aims to present an integrated optimisation-modelling computational approach for...
10.1109/TCAPT.2006.880509IEEE Transactions on Components and Packaging Technologies293560-569ITCP
Add to ORKG