Add to ORKGIncreasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based ...
In the past decades, device scaling along the Moore's Law trajectory has been the major focus of tec...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to ach...
In advanced technology nodes, aggressive device scaling along with fundamental physical (lithographi...
Recent years have seen a significant slowdown of density scaling in advanced semiconductor integrate...
Integrated circuits (ICs) are at the heart of modern electronics, which rely heavily on the state-of...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
textThe unabated silicon technology scaling makes design and manufacturing increasingly harder in na...
As we increasingly use advanced technology nodes to design integrated circuits (ICs), physical desig...
As the semiconductor industry strives to find novel technology scaling methods, the advanced technol...
Next-generation applications in mobile, automotive, internet of things, robotic, artificial intellig...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Lithography has always been the most critical process in integrated circuit (IC) fabrication. Below ...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
In the past decades, device scaling along the Moore's Law trajectory has been the major focus of tec...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to ach...
In advanced technology nodes, aggressive device scaling along with fundamental physical (lithographi...
Recent years have seen a significant slowdown of density scaling in advanced semiconductor integrate...
Integrated circuits (ICs) are at the heart of modern electronics, which rely heavily on the state-of...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
textThe unabated silicon technology scaling makes design and manufacturing increasingly harder in na...
As we increasingly use advanced technology nodes to design integrated circuits (ICs), physical desig...
As the semiconductor industry strives to find novel technology scaling methods, the advanced technol...
Next-generation applications in mobile, automotive, internet of things, robotic, artificial intellig...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Lithography has always been the most critical process in integrated circuit (IC) fabrication. Below ...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
In the past decades, device scaling along the Moore's Law trajectory has been the major focus of tec...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to ach...