Add to ORKGTodays microsystem technology requests the integration of multiple functions into a small volume. Compact design, increasing clock frequencies and plus rates lead to an increasing power density. In this project different aspects of this trend originating from different areas of microelectronic systems with high heat dissipation are investigated: For the fabrication of intelligent power control a technique was developed, which combines thick-film multilayers with thin-film techniques. Aim of this multichip module is to combine advantages of thick-film technology with dense thin-film wiring. Efforts are made to integrate the housing of a high frequency module directly on the ceramic substrate. Therefore impedance matched feedthroughs based on...
The integration of high-voltage thin film transistors with a released MEMS process onto the same sub...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...
The requirement to install electronic power and control systems in high temperature environments has...
As part of the project 'Micro System technology for modules with high power dissipation' the Technic...
In microsystems it is necessary to rule permanent rising integration densities. So it is in microwav...
In all forms of multi-chip-modules (MCMs) developed so far, the interconnects between ICs and substr...
The development of field-controlled power switches, especially insulated gate bipolar transistors, e...
Several applications in the fields of industrial sensors and power electronics are creating a demand...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated...
This paper describes the use of thermally conductive adhesives for the attachment of high power mult...
In power electronics there are still growing demands on the conception and integration of power devi...
The thermal management of Electronic systems plays a major rule for new IT-Systemcomponents of the n...
A combination of ceramic substrate technology with thin film processes will be presented. Thick film...
System integration technology requires multi-functionality and in many cases energy autarkic systems...
The integration of high-voltage thin film transistors with a released MEMS process onto the same sub...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...
The requirement to install electronic power and control systems in high temperature environments has...
As part of the project 'Micro System technology for modules with high power dissipation' the Technic...
In microsystems it is necessary to rule permanent rising integration densities. So it is in microwav...
In all forms of multi-chip-modules (MCMs) developed so far, the interconnects between ICs and substr...
The development of field-controlled power switches, especially insulated gate bipolar transistors, e...
Several applications in the fields of industrial sensors and power electronics are creating a demand...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated...
This paper describes the use of thermally conductive adhesives for the attachment of high power mult...
In power electronics there are still growing demands on the conception and integration of power devi...
The thermal management of Electronic systems plays a major rule for new IT-Systemcomponents of the n...
A combination of ceramic substrate technology with thin film processes will be presented. Thick film...
System integration technology requires multi-functionality and in many cases energy autarkic systems...
The integration of high-voltage thin film transistors with a released MEMS process onto the same sub...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...
The requirement to install electronic power and control systems in high temperature environments has...