Add to ORKGAs part of the project 'Micro System technology for modules with high power dissipation' the Technical University of Berlin performed thermal analyses of complex modules and developed new technologies for the packaging, interconnection and wiring of high power modules. Thin film deposition technology of photosensitive polymers for RF-modules (MCM-D) and combination of thin film and thick film technology have been developed. Technology and characterization of laser patterned aluminum nitride micro channel heat sinks have been investigated in detail. By combination of high performance coolers, adhesive bonding technology with low thermal resistance and MCM-D technology a new generation of power modules have been developed which allow for a ve...
Three low pressure micro-resistojets (LPM) with integrated heater and temperature measurement were d...
Current microsystems as a rule are limited in their operating temperature to a maximum of 125 C. In ...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...
Todays microsystem technology requests the integration of multiple functions into a small volume. Co...
The thermal management of Electronic systems plays a major rule for new IT-Systemcomponents of the n...
The project 'GaAs Power Modules for Communication Systems in the Frequency Range 30-50 GHz' is embed...
Since the introduction of the first power module by Semikron in 1975, many innovations have been mad...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
In microsystems it is necessary to rule permanent rising integration densities. So it is in microwav...
Several applications in the fields of industrial sensors and power electronics are creating a demand...
This paper describes the use of thermally conductive adhesives for the attachment of high power mult...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microe...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microe...
During the joint research project a pilot system for the fabrication of thin-film solar modules cons...
Polysiloxane layers sensitive to electron beams and no light have been obtained by plasma aided vapo...
Three low pressure micro-resistojets (LPM) with integrated heater and temperature measurement were d...
Current microsystems as a rule are limited in their operating temperature to a maximum of 125 C. In ...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...
Todays microsystem technology requests the integration of multiple functions into a small volume. Co...
The thermal management of Electronic systems plays a major rule for new IT-Systemcomponents of the n...
The project 'GaAs Power Modules for Communication Systems in the Frequency Range 30-50 GHz' is embed...
Since the introduction of the first power module by Semikron in 1975, many innovations have been mad...
Higher numbers of chip I/Os, rising clock frequencies and the miniaturization are resulting in an in...
In microsystems it is necessary to rule permanent rising integration densities. So it is in microwav...
Several applications in the fields of industrial sensors and power electronics are creating a demand...
This paper describes the use of thermally conductive adhesives for the attachment of high power mult...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microe...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microe...
During the joint research project a pilot system for the fabrication of thin-film solar modules cons...
Polysiloxane layers sensitive to electron beams and no light have been obtained by plasma aided vapo...
Three low pressure micro-resistojets (LPM) with integrated heater and temperature measurement were d...
Current microsystems as a rule are limited in their operating temperature to a maximum of 125 C. In ...
As the volume of operating data increases, so it is that with power semiconductors there is an ever-...