Different techniques for the assembly of integrated optical devices with electrical interfaces were reviewed and tested. The applicability of the following techniques has been assessed in order to direct future research and development work in this field: Jointing techniques (sticking systems, laser soldering, laser welding, anodic bonding, shape-memory metal alloys, gas soldering, GRI linse coupling), array-chip coupling using structuring methods (etching, LIGA, plastic forming, laser ablation, bumb structures), casing techniques and simulation methods. (WEN)SIGLEAvailable from TIB Hannover: RO 3532(2) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Forschung und Technologie (BMFT)...