Optimization of Printed Circuit board design assembly based on DPMO metrics

The paper deals with optimization of printed circuit board assembly (PCBA) design based on defects per million opportunities (DPMO) metric. Due to DPMO data predictions for a given new PCBA design is possible to optimize its layout in terms of yield and quality even before the PCBA pilot production. The DPMO data are obtained from the below presented yield-DPMO model. The model is based on a combination of elements from DPMO calculation according to the IPC 7912 standard and two most used yield prediction methodologies, namely: process yield and board design yield. The model provides not only DPMO data, but also assembly process yield prediction that can assist the manufacturers in determining reliable estimates of production capabilities