Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1 x 10(16) neq cm(-2) (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-...
Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for ...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are ...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip ar...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiatio...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Results of an extensive R&D program aiming at radiation hard, small pitch, 3D pixel sensors are ...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
This paper describes the development of new 3D and planar silicon pixel sensors designed for the Com...
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detec...
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-...
Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for ...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are ...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip ar...
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiatio...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Results of an extensive R&D program aiming at radiation hard, small pitch, 3D pixel sensors are ...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
This paper describes the development of new 3D and planar silicon pixel sensors designed for the Com...
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detec...
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-...
Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for ...