Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance, comply with these extreme conditions. A full study and characterization of pixelated 3D sensors fabricated by FBK is presented here. The sensors were bump-bonded to RD53A readout chips and measured at several CERN SPS test beams. Results on charge collection and efficiency, for both non-irradiated and irradiated up to 1016 neq/cm2 samples, are presented. Two main studies are described: in the first the behaviour of the sensor is qualified as a function of irradiation, while kept under identical condition...
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate...
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detec...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2...
The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and ...
Results of an extensive R&D program aiming at radiation hard, small pitch, 3D pixel sensors are ...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiatio...
Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for ...
The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate...
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detec...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2...
The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and ...
Results of an extensive R&D program aiming at radiation hard, small pitch, 3D pixel sensors are ...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiatio...
Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for ...
The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The CMS silicon pixel detector is the tracking device closest to the LHC p-p collisions, which preci...
Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate...
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detec...