The current trend in scaling transistor gate length below 60 nm is posing great challenges both related to process technology and circuit/system design. From the process technology point of view it is becoming increasingly difficult to continue scaling in traditional way due to fundamental limitations like resolution, quantum effects or random fluctuations. In turn, this has an important impact on electricaldevice specifications especially leakage current and the circuit power dissipation
The core of this thesis is a thorough investigation of the scaling properties of conventional nano-C...
Semiconductor technology has reached an end in the manufacture of conventional Metal Oxide semicondu...
Over the years, many new materials have been introduced in advanced complementary metal oxide semico...
The scaling of CMOS technology has progressed rapidly for three decades, contributing to the superio...
Maintaining the pace of MOSFET device scaling has become increasingly difficult in the sub-100nm gat...
The scaling of the gate length down in CMOS devices increases the drivecurrent performance and the d...
[[abstract]]To reconcile scaling-driven fundamental material limitations with industry evolution req...
In this paper an overview on the main issues in analog IC design in scaled CMOS technology is presen...
Since the end of the last millenium, the microelectronics industry has been facing new issues as fa...
Since the end of the last millenium, the microelectronics industry has been facing new issues as fa...
CMOS technology is scaling down to meet the performance, production cost, and power requirements of ...
According to Moore‟s Law, the no of transistors in an IC chip doubles every 18 months. This leads in...
An overview of critical integration issues for future generation MOSFETs towards 10 nm gate length i...
Abstract—This review paper explores considerations for ul-timate CMOS transistor scaling. Transistor...
According to the international technology roadmap for semiconductors (ITRS), 32 nm technology node w...
The core of this thesis is a thorough investigation of the scaling properties of conventional nano-C...
Semiconductor technology has reached an end in the manufacture of conventional Metal Oxide semicondu...
Over the years, many new materials have been introduced in advanced complementary metal oxide semico...
The scaling of CMOS technology has progressed rapidly for three decades, contributing to the superio...
Maintaining the pace of MOSFET device scaling has become increasingly difficult in the sub-100nm gat...
The scaling of the gate length down in CMOS devices increases the drivecurrent performance and the d...
[[abstract]]To reconcile scaling-driven fundamental material limitations with industry evolution req...
In this paper an overview on the main issues in analog IC design in scaled CMOS technology is presen...
Since the end of the last millenium, the microelectronics industry has been facing new issues as fa...
Since the end of the last millenium, the microelectronics industry has been facing new issues as fa...
CMOS technology is scaling down to meet the performance, production cost, and power requirements of ...
According to Moore‟s Law, the no of transistors in an IC chip doubles every 18 months. This leads in...
An overview of critical integration issues for future generation MOSFETs towards 10 nm gate length i...
Abstract—This review paper explores considerations for ul-timate CMOS transistor scaling. Transistor...
According to the international technology roadmap for semiconductors (ITRS), 32 nm technology node w...
The core of this thesis is a thorough investigation of the scaling properties of conventional nano-C...
Semiconductor technology has reached an end in the manufacture of conventional Metal Oxide semicondu...
Over the years, many new materials have been introduced in advanced complementary metal oxide semico...