When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper
With an increased data rate of high-speed PCBs, an increase in crosstalk degrades the signal integri...
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via tra...
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known tec...
Due to the increase in board density, routing traces on different layers becomes a widely used strat...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
This paper focuses on the modeling method of common interconnects which act as coupling channels in ...
This publication discusses a specific ground-signal-signal-ground (GSSG) configuration of a high-spe...
In a previous paper [1] the authors introduced the concept of physical or physics-based models f...
The interaction of the electromagnetic fields generated by electronic products, known as Electromagn...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
An accurate analytical model to predict via coupling within rectangular power-return plane structure...
The power/ground plane structure within an electronic system not only delivers power, but also provi...
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from e...
In the design of high-speed multi-layer board, the partitioning of the power/ground plane breaks ret...
The returning displacement currents of vias transiting multilayered stack-ups in electronic packages...
With an increased data rate of high-speed PCBs, an increase in crosstalk degrades the signal integri...
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via tra...
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known tec...
Due to the increase in board density, routing traces on different layers becomes a widely used strat...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
This paper focuses on the modeling method of common interconnects which act as coupling channels in ...
This publication discusses a specific ground-signal-signal-ground (GSSG) configuration of a high-spe...
In a previous paper [1] the authors introduced the concept of physical or physics-based models f...
The interaction of the electromagnetic fields generated by electronic products, known as Electromagn...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
An accurate analytical model to predict via coupling within rectangular power-return plane structure...
The power/ground plane structure within an electronic system not only delivers power, but also provi...
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from e...
In the design of high-speed multi-layer board, the partitioning of the power/ground plane breaks ret...
The returning displacement currents of vias transiting multilayered stack-ups in electronic packages...
With an increased data rate of high-speed PCBs, an increase in crosstalk degrades the signal integri...
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via tra...
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known tec...