An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed to suppress the electromagnetic radiation induced by ground bounce. After separating the even and odd modes in alternating planes, the far-field radiation of parallel plates is derived using Huygens' principle. It is mainly contributed by the odd mode excitation, while the even mode sets a lower bound on the radiation level from the system when shorting vias are inserted between alternating ground plates. For the odd-mode radiation, a canonical problem is then constructed and analytically solved by applying image theory. Based on that, a systematic approach to achieve the optimum suppression design is developed for the various geometry param...
The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical pr...
A two-step methodology for predicting the radiated fields from lines radiating in the presence of co...
Experimental investigation was made on electromagnetic noise radiated from a digital IC package on a...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
The effect on EMI of stitching multiple ground planes together along the periphery of multi-layer PC...
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonan...
Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (I...
Now-a-days, the usage for the high speed printed circuit boards are increased. Inorder to satisfy th...
Power/ground partitioning has been used to supply multivoltage levels and to isolate power/ground no...
Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) ...
Stacked-card and modules-on-backplane printed circuit board geometries are advantageous for conservi...
The interaction of the electromagnetic fields generated by electronic products, known as Electromagn...
In modern printed electronics, the performances of a circuit and a device are severely deteriorated ...
In modern printed electronics, the performances of a circuit and a device are severely deteriorated ...
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via tra...
The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical pr...
A two-step methodology for predicting the radiated fields from lines radiating in the presence of co...
Experimental investigation was made on electromagnetic noise radiated from a digital IC package on a...
An analytical mode analysis of vias in the multilayered printed-circuit-board periphery is developed...
The effect on EMI of stitching multiple ground planes together along the periphery of multi-layer PC...
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonan...
Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (I...
Now-a-days, the usage for the high speed printed circuit boards are increased. Inorder to satisfy th...
Power/ground partitioning has been used to supply multivoltage levels and to isolate power/ground no...
Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) ...
Stacked-card and modules-on-backplane printed circuit board geometries are advantageous for conservi...
The interaction of the electromagnetic fields generated by electronic products, known as Electromagn...
In modern printed electronics, the performances of a circuit and a device are severely deteriorated ...
In modern printed electronics, the performances of a circuit and a device are severely deteriorated ...
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via tra...
The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical pr...
A two-step methodology for predicting the radiated fields from lines radiating in the presence of co...
Experimental investigation was made on electromagnetic noise radiated from a digital IC package on a...