none4Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. However, it is critical to develop dedicated system-level design methodologies for multi-core architectures that seamlessly address their thermal modeling, analysis and management. In this work, we first formulate the problem of system-level thermal modeling and link it to produce a global thermal management formulation as a discrete-time optimal control problem, which can be solved using finite-horizon model-predictive control (MPC) techniques, while adapting to the actual time-varying un...
none4siModern Multiprocessor Systems-on-Chip (MP- SoC) offer high computing performance at the expe...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
none4noHigh-end multicore processors are characterized by high power density with significant spatia...
none4siModern Multiprocessor Systems-on-Chip (MP- SoC) offer high computing performance at the expe...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
none4noHigh-end multicore processors are characterized by high power density with significant spatia...
none4siModern Multiprocessor Systems-on-Chip (MP- SoC) offer high computing performance at the expe...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...