Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. However, it is critical to develop dedicated system-level design methodologies for multi-core architectures that seamlessly address their thermal modeling, analysis and management. In this work, we first formulate the problem of system-level thermal modeling and link it to produce a global thermal management formulation as a discrete-time optimal control problem, which can be solved using finite-horizon model-predictive control (MPC) techniques, while adapting to the actual time-varying unbalan...
none4noHigh-end multicore processors are characterized by high power density with significant spatia...
The reliability of multiprocessor system-on-chips (MPSoCs) is nowadays threatened by high chip tempe...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
none4Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
none4noHigh-end multicore processors are characterized by high power density with significant spatia...
The reliability of multiprocessor system-on-chips (MPSoCs) is nowadays threatened by high chip tempe...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
none4Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
As result of technology scaling, single-chip multi-core power density increases and its spatial and ...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
none4noHigh-end multicore processors are characterized by high power density with significant spatia...
The reliability of multiprocessor system-on-chips (MPSoCs) is nowadays threatened by high chip tempe...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...