In view of applications in the tracking detectors at the High Luminosity LHC (HL-LHC), we have developed a new generation of 3D pixel sensors featuring small-pitch (50 × 50 or 25 × 100 μ m2) and thin active layer (~ 100 μ m). Owing to the very short inter-electrode distance (~ 30 μ m), charge trapping effects can be strongly mitigated, making these sensors extremely radiation hard. However, the downscaled sensor structure also lends itself to high electric fields as the bias voltage is increased, motivating investigation of leakage current increase in order to prevent premature electrical breakdown due to impact ionization. In order to assess the characteristics of heavily irradiated samples, using 3D diodes as test devices, we have carried...
3D sensors are a promising option for the innermost pixel layers at the High Luminosity LHC. Howeve...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
We report on the characterization of a new version of double-sided 3D sensors fabricated at FBK (Tre...
3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the ge...
We report on the characterization by a position resolved laser system of small-pitch 3D diodes irrad...
3D type of pixel sensors is a promising option for the innermost pixel layer at the High-Luminosity ...
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising ca...
Three-dimensional (3D) silicon detectors offer advantages over standard planar devices as more radia...
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising can...
We report on the characterization by a position resolved laser system of small-pitch 3D diodes irrad...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2...
The upgrades of High Energy Physics (HEP) experiments at the Large Hadron Collider (LHC) will call f...
3D sensors are a promising option for the innermost pixel layers at the High Luminosity LHC. Howeve...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
We report on the characterization of a new version of double-sided 3D sensors fabricated at FBK (Tre...
3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the ge...
We report on the characterization by a position resolved laser system of small-pitch 3D diodes irrad...
3D type of pixel sensors is a promising option for the innermost pixel layer at the High-Luminosity ...
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising ca...
Three-dimensional (3D) silicon detectors offer advantages over standard planar devices as more radia...
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising can...
We report on the characterization by a position resolved laser system of small-pitch 3D diodes irrad...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requiremen...
In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2...
The upgrades of High Energy Physics (HEP) experiments at the Large Hadron Collider (LHC) will call f...
3D sensors are a promising option for the innermost pixel layers at the High Luminosity LHC. Howeve...
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are...
We report on the characterization of a new version of double-sided 3D sensors fabricated at FBK (Tre...