The effect of homogeneous contamination on the oxide integrity is studied by electrical measurements. The contamination is introduced in the Buffered Oxide Etchant (BOE) used for the pre-oxidation clean. The DC parametric test of forcing 1 nA and measuring voltage across the oxide is used to relate contamination to the leakage current and also to the number of failures. The factors affecting the measured voltage such as temperature, light and noise are eliminated so that contamination dominates the change in the measured voltage. The current-transport mechanism through the oxide was found to obey the Fowler-Nordheim equation at high fields. The barrier height at both interfaces was lowered in some devices. A technique for measuring the low-...
Damage of the gate oxide induced by plasma processing, due to charge buildup on conductors in ohmic ...
The degradation of MOSFETs under high field stress has been investigated for a long time. The degrad...
During recent years the thickness of the gate oxide has been reduced considerably. The progressive m...
As semiconductor devices get faster and more compact, the equivalent gate dielectric thickness is re...
In this thesis, the degradation of ultrathin gate oxide caused by electrical stress has been studied...
This paper collects the results of a study aimed to investigate the impact of organic contamination ...
In this paper, we compare the hot carrier (HC) stress and oxide breakdown results with the fast and ...
[[abstract]]In this paper, we describe the effects that five metallic contaminants have on the elect...
[[abstract]]We have studied the effect of copper contamination after the front-end metal-oxide-semic...
Modern ULSI technology is currently pushing the limits of metal-oxide-semiconductor field-effect-tra...
The purpose of this thesis was to investigate the effects of pre- and post-oxidation RCA cleaning on...
Abstract- A low leakage characterization technique for the lateral profiling of interface and oxide ...
Capacitance-Voltage (C-V) arid Conductance-Voltage (G-V) measurements were performed to characterize...
The impact of platinum contamination on the breakdown properties of gate oxide is reported. Wafers w...
Contamination of silicon with trace amounts of copper during processing can adversely affect the gat...
Damage of the gate oxide induced by plasma processing, due to charge buildup on conductors in ohmic ...
The degradation of MOSFETs under high field stress has been investigated for a long time. The degrad...
During recent years the thickness of the gate oxide has been reduced considerably. The progressive m...
As semiconductor devices get faster and more compact, the equivalent gate dielectric thickness is re...
In this thesis, the degradation of ultrathin gate oxide caused by electrical stress has been studied...
This paper collects the results of a study aimed to investigate the impact of organic contamination ...
In this paper, we compare the hot carrier (HC) stress and oxide breakdown results with the fast and ...
[[abstract]]In this paper, we describe the effects that five metallic contaminants have on the elect...
[[abstract]]We have studied the effect of copper contamination after the front-end metal-oxide-semic...
Modern ULSI technology is currently pushing the limits of metal-oxide-semiconductor field-effect-tra...
The purpose of this thesis was to investigate the effects of pre- and post-oxidation RCA cleaning on...
Abstract- A low leakage characterization technique for the lateral profiling of interface and oxide ...
Capacitance-Voltage (C-V) arid Conductance-Voltage (G-V) measurements were performed to characterize...
The impact of platinum contamination on the breakdown properties of gate oxide is reported. Wafers w...
Contamination of silicon with trace amounts of copper during processing can adversely affect the gat...
Damage of the gate oxide induced by plasma processing, due to charge buildup on conductors in ohmic ...
The degradation of MOSFETs under high field stress has been investigated for a long time. The degrad...
During recent years the thickness of the gate oxide has been reduced considerably. The progressive m...