A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications
Thermal interface materials (TIM) of polymer networks and boron nitride were infiltrated with indium...
Due to escalating power densities in electronics, information, communication, energy storage, aerosp...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
Dealing with increasing power densities in high performance micro-and power -electronics application...
Nanoengineered materials have emerged as efficient thermal interface materials in a variety of therm...
Efficient heat dissipation is a critical requirement for sustained performance and failure preventio...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
Thermal interface materials (TIM) of polymer networks and boron nitride were infiltrated with indium...
Due to escalating power densities in electronics, information, communication, energy storage, aerosp...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
Dealing with increasing power densities in high performance micro-and power -electronics application...
Nanoengineered materials have emerged as efficient thermal interface materials in a variety of therm...
Efficient heat dissipation is a critical requirement for sustained performance and failure preventio...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
Thermal interface materials (TIM) of polymer networks and boron nitride were infiltrated with indium...
Due to escalating power densities in electronics, information, communication, energy storage, aerosp...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...