In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated with indium aimed at thermal interface material applications is presented. A porous nanofibrous structure was prepared by electrospinning of polyimide. An interfacial nanocomposite layer of silver nanoparticles partially or fully embedded in the polyimide matrix was synthesized on the fiber surfaces, followed by autocatalytic deposition of a uniform silver coating (using the interfacial layer as an anchored seed layer) serving as a reactive wetting layer for the infiltrating melt. The thermal performance of the composite was evaluated and the thermal conductivity was determined to be 27 W/mK, accompanied by low contact resistance of the metal...
This thesis focuses on studies of nano-scale materials in electronic packaging applications with res...
Silver (Ag) metal-plated nanofibers were prepared from nylon 6/silver iodide (AgI) composite nanofib...
This thesis demonstrates the use of electrospinning and the novel properties of electrospun material...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
A new composite design approach for thermal interface materials is presented. A porous electro spun ...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
A methodology for fabricating hierarchical nanostructures by surface-confined synthesis of silver na...
A methodology for fabricating hierarchical nanostructures by surface-confined synthesis of silver na...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
This thesis explores the integration of functional electrospun micro- and nanofiber based materials ...
Dealing with increasing power densities in high performance micro-and power -electronics application...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
Both pure polyimide (PI) and Fe-FeO nanoparticles reinforced PI nanocomposite fibers with a particle...
This thesis focuses on studies of nano-scale materials in electronic packaging applications with res...
Silver (Ag) metal-plated nanofibers were prepared from nylon 6/silver iodide (AgI) composite nanofib...
This thesis demonstrates the use of electrospinning and the novel properties of electrospun material...
In this letter, a composite structure based on a porous electrospun polyimide structure infiltrated ...
A new composite design approach for thermal interface materials is presented. A porous electro spun ...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
A methodology for fabricating hierarchical nanostructures by surface-confined synthesis of silver na...
A methodology for fabricating hierarchical nanostructures by surface-confined synthesis of silver na...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
This thesis explores the integration of functional electrospun micro- and nanofiber based materials ...
Dealing with increasing power densities in high performance micro-and power -electronics application...
The increasing integration of microelectronics, raising the need for effective heat dissipation, req...
Both pure polyimide (PI) and Fe-FeO nanoparticles reinforced PI nanocomposite fibers with a particle...
This thesis focuses on studies of nano-scale materials in electronic packaging applications with res...
Silver (Ag) metal-plated nanofibers were prepared from nylon 6/silver iodide (AgI) composite nanofib...
This thesis demonstrates the use of electrospinning and the novel properties of electrospun material...