Thermal interface materials (TIM) of polymer networks and boron nitride were infiltrated with indium and investigated in parallel in order to produce drastically improved thermal properties of thermal interface material. The materials were composed of electrospun polymer or BN fiber network and infiltrated indium. The mechanical tensile and shear test showed that the electrospun polymer network has superior reliability properties. The materials were also investigated in terms of adherence to a surface. Practical tests showed that the indium infiltrated thermal interfae materials best adhere to a Sn coated surface. As a final benchmark the best interface material, polymer fiber-indium TIM (NanoTIM), was benchmarked against a state-of-The-Art...
abstract: This thesis project explains what thermal interface materials (TIMs) are, what they are us...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface mate...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface mate...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
abstract: This thesis project explains what thermal interface materials (TIMs) are, what they are us...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...
This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silv...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface mate...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface mate...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
With increased power density and continued miniaturization, effective thermal dissipation is of sign...
abstract: This thesis project explains what thermal interface materials (TIMs) are, what they are us...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...
Increasing power densities within microelectronic systems place an ever increasing demand on the the...