In this paper, we present efficient test patterns for the crosstalk–induced faults on System-on-a-Chip and board level interconnects considering actual effective aggressors to minimize the pattern size. All static faults also can be detected. The proposed method achieved the significant reduction of the number of test patterns than prior works, while preserving 100% fault coverage. We are in the process of extending the proposed technique to built-in-self test logics
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
This paper analyses some of the most common error-detecting codes used in self-checking circuits wit...
When testing the interconnect structures on a board, test programmers sometimes ask, How can I contr...
The effect of crosstalk-induced errors becomes more significant in high-performance circuits and sys...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
UnrestrictedThe shrinking of the dimensions of on-chip interconnects (global interconnects, includin...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susc...
Most BIST architectures use pseudo-random test pattern generators. However, whenever this technique ...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
This paper analyses some of the most common error-detecting codes used in self-checking circuits wit...
When testing the interconnect structures on a board, test programmers sometimes ask, How can I contr...
The effect of crosstalk-induced errors becomes more significant in high-performance circuits and sys...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
UnrestrictedThe shrinking of the dimensions of on-chip interconnects (global interconnects, includin...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susc...
Most BIST architectures use pseudo-random test pattern generators. However, whenever this technique ...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
This paper analyses some of the most common error-detecting codes used in self-checking circuits wit...
When testing the interconnect structures on a board, test programmers sometimes ask, How can I contr...