The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of crosstalk faults that may happen to bus-type interconnections between built in blocks within a System-on-Chip structure. The new idea is an improvement of the TPG design proposed by the author in one of the previous studies. The TPG circuit is meant to generate test sequences that guarantee detection of all crosstalk faults with the capacitive nature that may occur between individual lines within an interconnecting bus. The study comprises a synthesizable and parameterized model developed for the presented TPG in the VLSI Hardware Description Language (VHDL) with further investigation of properties and features of the offered module. The sign...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The effect of crosstalk-induced errors becomes more significant in high-performance circuits and sys...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
In this paper, we present efficient test patterns for the crosstalk–induced faults on System-...
Testing of an electronic chip is an important step in the design process, as it can detect faults an...
In recent years, crosstalk noise has emerged a serious problem because more and more devices and wir...
In recent years, crosstalk noise has emerged a serious problem because more and more devices and wir...
This paper analyses some of the most common error-detecting codes used in self-checking circuits wit...
Snehal Udar, for the Doctor of Philosophy degree in Electrical and Computer Engineering, presented o...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
In this paper we propose a new Test Pattern Generator (TPG) for the detection of realistic faults oc...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The effect of crosstalk-induced errors becomes more significant in high-performance circuits and sys...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
In this paper, we present efficient test patterns for the crosstalk–induced faults on System-...
Testing of an electronic chip is an important step in the design process, as it can detect faults an...
In recent years, crosstalk noise has emerged a serious problem because more and more devices and wir...
In recent years, crosstalk noise has emerged a serious problem because more and more devices and wir...
This paper analyses some of the most common error-detecting codes used in self-checking circuits wit...
Snehal Udar, for the Doctor of Philosophy degree in Electrical and Computer Engineering, presented o...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
In this paper we propose a new Test Pattern Generator (TPG) for the detection of realistic faults oc...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
[[abstract]]A test pattern generation and comparison circuit creates test pattern stimulus signals f...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...