The effect of crosstalk-induced errors becomes more significant in high-performance circuits and systems. In this paper, compact crosstalk test patterns are introduced for a system-on-a-chip and board level interconnects considering physically effective aggressors. By being able to target multiple victim lines, 6n, where n is the number of nets patterns are drastically reduced to a constant number 6D, where D indicates the effective distance among interconnect nets. The test quality for static and crosstalk faults are completely preserved with 6D patterns.This work was supported by ETRI SoC Industry Promotion Center, Human Resource Development Project for IT SoC Architect
[[abstract]]Increased noise/interference effects, such as crosstalk, power supply noise, substrate n...
As chip size and design density increase, coupling effects (crosstalk) between signal wires become i...
Extend Unterminated Line (EUL) structure allows crosstalk measurements with perfect termination and ...
In this paper, we present efficient test patterns for the crosstalk–induced faults on System-...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
UnrestrictedThe shrinking of the dimensions of on-chip interconnects (global interconnects, includin...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susc...
[[abstract]]Increased noise/interference effects, such as crosstalk, power supply noise, substrate n...
As chip size and design density increase, coupling effects (crosstalk) between signal wires become i...
Extend Unterminated Line (EUL) structure allows crosstalk measurements with perfect termination and ...
In this paper, we present efficient test patterns for the crosstalk–induced faults on System-...
Capacitance-coupling and mutual inductance between the neighboring wires of global interconnects giv...
UnrestrictedThe shrinking of the dimensions of on-chip interconnects (global interconnects, includin...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of ...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based multi-die packages (a.k.a. 2.5D- and 3D-ICs) implement large amounts of inter-die inte...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the co...
Chiplet-based (2.5D and 3D) multi-die packages implement large amounts of inter-die interconnects wi...
Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susc...
[[abstract]]Increased noise/interference effects, such as crosstalk, power supply noise, substrate n...
As chip size and design density increase, coupling effects (crosstalk) between signal wires become i...
Extend Unterminated Line (EUL) structure allows crosstalk measurements with perfect termination and ...