A TSV repair method for clustered faults

Three-dimensional integrated circuits (3D-ICs) using Through-silicon Vias (TSVs) allow the stacking multiple dies to manufacture chips with many benefits, such as high density and high bandwidth. Unfortunately, the yield of 3D dies, stacking with a large number of TSVs is significantly impacted by the reliability of TSVs. In order to improve the yield of 3D-ICs, TSVs must be reparable. In practice, the faulty TSVs may cluster because of the imperfect bonding quality of TSVs. A right trapezoidal grouping based method was proposed to repair clustered faulty TSVs in this paper. Experimental results show that the yield of the proposed method is 99.80% with 50% area reduction compared to that of the router-based method. ? 2015 IEEE.E