Yield-aware time-efficient testing and self-fixing design for TSV-based 3D ICs

Abstract—Testing for three dimensional (3D) integrated cir-cuits (ICs) based on through-silicon-via (TSV) is one of the major challenges for improving the system yield and reducing the overall cost. The lack of pads on most tiers and the mechanical vulnerability of tiers after wafer thinning make it difficult to perform 3D Known-Good-Die (KGD) test with the existing 2D IC probing methods. This paper presents a novel and time-efficient 3D testing flow. In this Known-Good-Stack (KGS) flow, a yield-aware TSV defect searching and replacing strategy is introduced. The Build-in-Self-Test (BIST) design with TSV redundancy scheme can help improve the system yield for today’s imperfect TSV fabrication process. Our study shows that less than 6 redundant TSVs is enough to increase the TSV yield to 98 % for a TSV cluster with a size under 16×16 with relatively low initial TSV yield. The average TSV cluster testing and self-fixing time is about 3-16 testing cycle depending on the initial TSV yield.1 I