Advance of the fabrication technology has enhanced the size and density for the NAND Flash memory but also brought new types of defects which need to be tested for the quality consideration. This work analyzes three types of physical defects for the deep nano-meter NAND Flash memory based on the circuit level simulation and proposes new categories of interference faults (IFs). Testing algorithm is also proposed to test the faults under the worst case condition. The algorithm, in addition to test IFs, can also detect the conventional address faults, disturbance faults and other RAM-like faults for the NAND Flash. ? 2012 EDAA.EI
Mission-critical applications usually presents several critical issues: the required level of depend...
[[abstract]]In order to ease the time-to-market pressure of flash memory, we propose a fault-pattern...
[[abstract]]Flash memories are a type of non-volatile memory based on floating-gate transistors. The...
Testing NAND flash memories is a very complex issue due to the rapid scaling down of the technology ...
Abstract: This paper presents an overview of the problem of testing semiconductor random access memo...
[[abstract]]To explore all faulty behavior on NAND-type flash memory is impractical, and the defects...
Physical defects in the cells of the NAND Flash memory fluctuate the current flowing through the mem...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
Process variation in nanofabrication is the critical issue in both reliability and yield enhancement...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
[[abstract]]The famous NOR-type flash memory structure is included to develop flash memory fault mod...
[[abstract]]A March test, namely "March Flash" and an on-chip test circuit are presented to detect a...
Mission-critical applications usually presents several critical issues: the required level of depend...
Due to rapid and continuous technology scaling, faults in semiconductor memories (and ICs in general...
Mission-critical applications usually presents several critical issues: the required level of depend...
[[abstract]]In order to ease the time-to-market pressure of flash memory, we propose a fault-pattern...
[[abstract]]Flash memories are a type of non-volatile memory based on floating-gate transistors. The...
Testing NAND flash memories is a very complex issue due to the rapid scaling down of the technology ...
Abstract: This paper presents an overview of the problem of testing semiconductor random access memo...
[[abstract]]To explore all faulty behavior on NAND-type flash memory is impractical, and the defects...
Physical defects in the cells of the NAND Flash memory fluctuate the current flowing through the mem...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
Process variation in nanofabrication is the critical issue in both reliability and yield enhancement...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
Newer defects in memories arising from shrinking manufacturing technologies demand improved memory t...
[[abstract]]The famous NOR-type flash memory structure is included to develop flash memory fault mod...
[[abstract]]A March test, namely "March Flash" and an on-chip test circuit are presented to detect a...
Mission-critical applications usually presents several critical issues: the required level of depend...
Due to rapid and continuous technology scaling, faults in semiconductor memories (and ICs in general...
Mission-critical applications usually presents several critical issues: the required level of depend...
[[abstract]]In order to ease the time-to-market pressure of flash memory, we propose a fault-pattern...
[[abstract]]Flash memories are a type of non-volatile memory based on floating-gate transistors. The...