Die Kombination aus guten Hochtemperatureigenschaften, hoher Raumtemperaturduktilität, stark exothermer Synthesereaktion und Existenz bei Nicht-Stöchiometrie positioniert die intermetallische Phase RuAl im Anwendungsfeld von thermischen Schutzschichten und des Reaktivfügens. Die einphasige RuAl-Dünnschichtsynthese ist bislang noch nicht erforscht. Festkörperphasenumwandlungen und selbstfortschreitende Reaktionen in äquiatomaren Ru/Al-Multischichten werden daher erstmals grundlegend charakterisiert. Möglichkeiten der Umwandlungs- und Reaktionskontrolle durch die Doppelschichtdicke (Periode) werden aufgezeigt. Die Festkörperreaktion beginnt bei 150 °C mit einer Al-dominierten Interdiffusion an den Grenzflächen. Oberhalb von 300 °C werden peri...
Diffusional approaches for fabrication of multi-layered Ru-modified bond coats for thermal barrier ...
Ziel der vorliegenden Dissertation war, die Elektronendichte von RuAl2 anhand von Röntgenbeugungsdat...
The setting up of bonded structures, e.g. micromechanical sensors and actuators, using wafer bonding...
Die Kombination aus guten Hochtemperatureigenschaften, hoher Raumtemperaturduktilität, stark exother...
RuAl shows a high melting point, good ductility at room temperature and excellent oxidation resistan...
The Ru/Al system integrates high energy density and high product ductility and serves as an alternat...
Established and already commercialized energetic materials, such as those based on Ni/Al for joining...
Thin films demonstrate peculiar mass-transport and chemical reactions, which is a manifestation of t...
In this study, we report on phase formation and microstructure evolution in multiscale magnetron spu...
Ru-riched and equiatomic Ru–Al multilayered thin films were fabricated on Si and Inconel 617 s...
Die intermetallische B2-Phase RuAl (Rutheniumaluminid) weist eine herausragende Kombination von Eige...
The microstructure properties of reactive multilayers play a key role in their chemical reactions. R...
Advances in thermal barrier coating (TBC) technology for Ni-base superalloys have shown that B2 Pt-m...
This paper reports on a significant further improvement of the high temperature stability of RuAl th...
RuAl thin films possess a high potential as a high temperature stable metallization for surface acou...
Diffusional approaches for fabrication of multi-layered Ru-modified bond coats for thermal barrier ...
Ziel der vorliegenden Dissertation war, die Elektronendichte von RuAl2 anhand von Röntgenbeugungsdat...
The setting up of bonded structures, e.g. micromechanical sensors and actuators, using wafer bonding...
Die Kombination aus guten Hochtemperatureigenschaften, hoher Raumtemperaturduktilität, stark exother...
RuAl shows a high melting point, good ductility at room temperature and excellent oxidation resistan...
The Ru/Al system integrates high energy density and high product ductility and serves as an alternat...
Established and already commercialized energetic materials, such as those based on Ni/Al for joining...
Thin films demonstrate peculiar mass-transport and chemical reactions, which is a manifestation of t...
In this study, we report on phase formation and microstructure evolution in multiscale magnetron spu...
Ru-riched and equiatomic Ru–Al multilayered thin films were fabricated on Si and Inconel 617 s...
Die intermetallische B2-Phase RuAl (Rutheniumaluminid) weist eine herausragende Kombination von Eige...
The microstructure properties of reactive multilayers play a key role in their chemical reactions. R...
Advances in thermal barrier coating (TBC) technology for Ni-base superalloys have shown that B2 Pt-m...
This paper reports on a significant further improvement of the high temperature stability of RuAl th...
RuAl thin films possess a high potential as a high temperature stable metallization for surface acou...
Diffusional approaches for fabrication of multi-layered Ru-modified bond coats for thermal barrier ...
Ziel der vorliegenden Dissertation war, die Elektronendichte von RuAl2 anhand von Röntgenbeugungsdat...
The setting up of bonded structures, e.g. micromechanical sensors and actuators, using wafer bonding...