Background: Genome assembly is typically a two-stage process: contig assembly followed by the use of paired sequencing reads to join contigs into scaffolds. Scaffolds are usually the focus of reported assembly statistics; longer scaffolds greatly facilitate the use of genome sequences in downstream analyses, and it is appealing to present larger numbers as metrics of assembly performance. However, scaffolds are highly prone to errors, especially when generated using short reads, which can directly result in inflated assembly statistics. Results: Here we provide the first independent evaluation of scaffolding tools for second-generation sequencing data. We find large variations in the quality of results depending on the tool and dataset u...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Citation: Shelton, J. M., Coleman, M. C., Hemdon, N., Lu, N. Y., Lam, E. T., Anantharaman, T., . . ....
Background: Genome assembly is typically a two-stage process: contig assembly followed by the use o...
Motivation: Next-generation high-throughput sequencing has become a state-of-the-art technique in ge...
Background The use of short reads from High Throughput Sequencing (HTS) techniques is now commonplac...
Genomic research relies on computers to process large amounts of genomic data. In order to digitize ...
Motivation: Next-generation high-throughput sequencing (HTS) has become a state-of-the-art technique...
A Summary: Massively parallel sequencing is now widely used, but data interpretation is only as good...
New sequencing technology has dramatically altered the landscape of whole-genome sequencing, allowin...
Genome sequencing has become routine, however genome assembly still remains a challenge despite the ...
Motivation: The increasing availability of second-generation highthroughput sequencing (HTS) technol...
International audienceBackground: The sequencing depth provided by high-throughput sequencing techno...
Genome sequencing has become routine, however genome assembly still remains a challenge despite the ...
Summary: Recent technological progress has greatly facilitated de novo genome sequencing. However, d...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Citation: Shelton, J. M., Coleman, M. C., Hemdon, N., Lu, N. Y., Lam, E. T., Anantharaman, T., . . ....
Background: Genome assembly is typically a two-stage process: contig assembly followed by the use o...
Motivation: Next-generation high-throughput sequencing has become a state-of-the-art technique in ge...
Background The use of short reads from High Throughput Sequencing (HTS) techniques is now commonplac...
Genomic research relies on computers to process large amounts of genomic data. In order to digitize ...
Motivation: Next-generation high-throughput sequencing (HTS) has become a state-of-the-art technique...
A Summary: Massively parallel sequencing is now widely used, but data interpretation is only as good...
New sequencing technology has dramatically altered the landscape of whole-genome sequencing, allowin...
Genome sequencing has become routine, however genome assembly still remains a challenge despite the ...
Motivation: The increasing availability of second-generation highthroughput sequencing (HTS) technol...
International audienceBackground: The sequencing depth provided by high-throughput sequencing techno...
Genome sequencing has become routine, however genome assembly still remains a challenge despite the ...
Summary: Recent technological progress has greatly facilitated de novo genome sequencing. However, d...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Hi-C exploits contact frequencies between pairs of loci to bridge and order contigs during genome as...
Citation: Shelton, J. M., Coleman, M. C., Hemdon, N., Lu, N. Y., Lam, E. T., Anantharaman, T., . . ....