Methods for non-destructive inspection of layered materials are becoming more and more popular as a way of assuring product integrity and quality. In this paper, we present a model-based technique using ultrasonic measurements for classification of thin bonding layers within three-layered materials. This could be, for example, an adhesive bond between two thin plates, where the integrity of the bonding layer needs to be evaluated. The method is based on a model of the wave propagation of pulse-echo ultrasound that first reduces the measured data to a few parameters for each measured point. The model parameters are then fed into a statistical classifier that assigns the bonding layer to one of a set of predefined classes. In this paper, two ...