Significant accomplishments include development of a procedure to correct for the substantial differences of transistor delay time as measured with different instruments or with the same instrument at different frequencies; association of infrared response spectra of poor quality germanium gamma ray detectors with spectra of detectors fabricated from portions of a good crystal that had been degraded in known ways; and confirmation of the excellent quality and cosmetic appearance of ultrasonic bonds made with aluminum ribbon wire. Work is continuing on measurement of resistivity of semiconductor crystals; study of gold-doped silicon, development of the infrared response technique; evaluation of wire bonds and die attachment; and measurement ...
The final report for the automatic exposure control study for space sequential cameras, for the NASA...
The performance of two critical technology components required for a continuously rotatable heat pip...
The effect of power/temperature step stress when applied to a variety of semiconductor devices was e...
Feasibility of operating gallium arsenide devices in high temperature microelectronic circuit
Various aspects of a sensitivity analysis, in particular, the impact of variations in metal sheet re...
Purity requirements for solar cell grade silicon material was developed and defined by evaluating th...
The first study area involved magnesium oxide and the role of anion impurities, while the second are...
A program to determine the feasibility of performing in situ calibration of combustible gas detector...
Cubic SIC metal-insulator-semiconductor (MIS) capacitors with thermally grown or chemical-vapor-depo...
Progress from October 1, 1977, through December 31, 1977, is reported in the design of the 50 MT/yea...
Surveys of available Analog to Digital Converters (ADC) suitable for precision applications showed t...
Four possible arrangements of the materials experiment carrier (MEC) and power system (PS) thermal c...
P-side backside reflecting constant, photodiode characterization, and photodiode diffusion and G-R c...
Restructuring research objectives from a technical readiness demonstration program to an investigati...
Statistically significant quantitative structural imperfection measurements were made on samples fro...
The final report for the automatic exposure control study for space sequential cameras, for the NASA...
The performance of two critical technology components required for a continuously rotatable heat pip...
The effect of power/temperature step stress when applied to a variety of semiconductor devices was e...
Feasibility of operating gallium arsenide devices in high temperature microelectronic circuit
Various aspects of a sensitivity analysis, in particular, the impact of variations in metal sheet re...
Purity requirements for solar cell grade silicon material was developed and defined by evaluating th...
The first study area involved magnesium oxide and the role of anion impurities, while the second are...
A program to determine the feasibility of performing in situ calibration of combustible gas detector...
Cubic SIC metal-insulator-semiconductor (MIS) capacitors with thermally grown or chemical-vapor-depo...
Progress from October 1, 1977, through December 31, 1977, is reported in the design of the 50 MT/yea...
Surveys of available Analog to Digital Converters (ADC) suitable for precision applications showed t...
Four possible arrangements of the materials experiment carrier (MEC) and power system (PS) thermal c...
P-side backside reflecting constant, photodiode characterization, and photodiode diffusion and G-R c...
Restructuring research objectives from a technical readiness demonstration program to an investigati...
Statistically significant quantitative structural imperfection measurements were made on samples fro...
The final report for the automatic exposure control study for space sequential cameras, for the NASA...
The performance of two critical technology components required for a continuously rotatable heat pip...
The effect of power/temperature step stress when applied to a variety of semiconductor devices was e...