Additives containing carboxyl and amino groups increase the overpoten-tial of a copper cathode during electrolysis in an acid sulfate electrolyte, the amino group being more effective than the carboxyl. At a given additive concentration the overpotential increment apparently depends on the adsorp-tivity and size of the additive molecule. The adsorptivity in turn depends on the number and kind of polar functional groups, the structural relation be-tween electron-donating atoms, and the lattice dimensions of the copper deposit. It is suggested that the behavior of a chemisorbed additive can be understood in terms of two effects, (i) the complete blockage of growth sites by chemisorption bonds and (it) the partial blockage of adjacent sites by...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
A critical review of the literature pertaining to acid copper sulphate electrodeposition preceded th...
Halo-compounds of acetic acid present in small quantities in an acid copper sulphate bath have been ...
In this research, the effect of surface-active substances (CMC and DFP) on the electrolysis of coppe...
The presence of an addition agent during the electrodeposition of a metal introduces further complic...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
For thioglycolic acid (I) [68-11-1], (at concns. ≤10-8M), the η (activation overpotential durin...
In the electrodeposition of copper from a solution of acid copper sulphate as encountered in refiner...
Dodecyl trimethylammonium bromide (DTAB) addition to acidified copper sulphate bath changes the morp...
Three fundamental types of suppressor additives for copper electroplating could be identified by mea...
Small amts. of dyes and alkaloids in Cu sulfate baths modify the growth habits of Cu and alter the c...
New addition-depolarizers and their action mechanism were studied. An effect of moistering on the ca...
It is important to know the laws of copper electrodeposition from low-concentrated electrolytes cont...
Electrochemical deposition of metals on metals is a widely used industrial process and understanding...
Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning tech...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
A critical review of the literature pertaining to acid copper sulphate electrodeposition preceded th...
Halo-compounds of acetic acid present in small quantities in an acid copper sulphate bath have been ...
In this research, the effect of surface-active substances (CMC and DFP) on the electrolysis of coppe...
The presence of an addition agent during the electrodeposition of a metal introduces further complic...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
For thioglycolic acid (I) [68-11-1], (at concns. ≤10-8M), the η (activation overpotential durin...
In the electrodeposition of copper from a solution of acid copper sulphate as encountered in refiner...
Dodecyl trimethylammonium bromide (DTAB) addition to acidified copper sulphate bath changes the morp...
Three fundamental types of suppressor additives for copper electroplating could be identified by mea...
Small amts. of dyes and alkaloids in Cu sulfate baths modify the growth habits of Cu and alter the c...
New addition-depolarizers and their action mechanism were studied. An effect of moistering on the ca...
It is important to know the laws of copper electrodeposition from low-concentrated electrolytes cont...
Electrochemical deposition of metals on metals is a widely used industrial process and understanding...
Electrochemical nano and micro fabrication by flow and chemistry is a maskless micro-patterning tech...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
A critical review of the literature pertaining to acid copper sulphate electrodeposition preceded th...
Halo-compounds of acetic acid present in small quantities in an acid copper sulphate bath have been ...