The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure Tool (MET) optic has given rise to a new class of ultra-high resolution microexposure stations. Once such printing station has been developed and implemented at Lawrence Berkeley National Laboratory's Advanced Light Source. This flexible printing station utilizes a programmable coherence illuminator providing real-time pupil-fill control for advanced EUV resist and mask development. The Berkeley exposure system programmable illuminator enables several unique capabilities. Using dipole illumination out to {sigma}=1, the Berkeley tool supports equal-line-space printing down to 12 nm, well beyond the capabilities of similar tools. Using small-si...
This manuscript discusses the multilayer coating results for the primary and secondary mirrors of th...
In this paper the authors present the EUV laboratory exposure tool in a new configuration for in-ban...
Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm tech...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
Synchrotron-based EUV exposure tools continue to play a crucial roll in the development of EUV litho...
For volume nanoelectronics production using Extreme ultraviolet (EUV) lithography [1] to become a re...
With demonstrated resist resolution of 20 nm half pitch, the SEMATECH Berkeley BUV microfield exposu...
The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Law...
Microfield exposure tools (METs) play a crucial role in the development of extreme ultraviolet (EUV)...
Microfield exposure tools (METs) have and continue to play a dominant role in the development of ext...
The resolution limit of present 0.3 NA 13.5 nm wavelength micro-exposure tools is compared to next g...
Although tremendous progress has been made in the crucial area of fabrication of extreme ultraviolet...
Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultr...
Microfield exposure tools (METs) continue to playa dominant role in the development of extreme ultra...
The work described in this dissertation has improved three essential components of extreme ultraviol...
This manuscript discusses the multilayer coating results for the primary and secondary mirrors of th...
In this paper the authors present the EUV laboratory exposure tool in a new configuration for in-ban...
Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm tech...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
Synchrotron-based EUV exposure tools continue to play a crucial roll in the development of EUV litho...
For volume nanoelectronics production using Extreme ultraviolet (EUV) lithography [1] to become a re...
With demonstrated resist resolution of 20 nm half pitch, the SEMATECH Berkeley BUV microfield exposu...
The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Law...
Microfield exposure tools (METs) play a crucial role in the development of extreme ultraviolet (EUV)...
Microfield exposure tools (METs) have and continue to play a dominant role in the development of ext...
The resolution limit of present 0.3 NA 13.5 nm wavelength micro-exposure tools is compared to next g...
Although tremendous progress has been made in the crucial area of fabrication of extreme ultraviolet...
Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultr...
Microfield exposure tools (METs) continue to playa dominant role in the development of extreme ultra...
The work described in this dissertation has improved three essential components of extreme ultraviol...
This manuscript discusses the multilayer coating results for the primary and secondary mirrors of th...
In this paper the authors present the EUV laboratory exposure tool in a new configuration for in-ban...
Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm tech...